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Application

Our team analyses each requirement using our unique methodology that combines the principles of physics and data diagnostics using in-house algorithms. Our persistence on good quality data collection and high-resolution analyse has made us stand out from the conventional; the methodology has allowed us to define individually the signature of each machine. The data is analyzed real-time to maximize machine performance. The system ingeniously looks for correlations across multiple parameters and compares the results against predefined goals or data from a base-line run. 

Our solution has been successfully implemented in the below department:
CMP
CVD
LITHO
METRO
DIFFUSION
WET ETCH

ROBOTICS STABILITY MONITORING

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Sigenic’s Robotics Stability Solution provides comprehensive, high accuracy and real-time monitoring of the condition of targeted robots throughout the integrated circuit manufacturing process. This ensures successful automated silicon wafer transfer and logistics. The solution prevents unwanted excursions, identifies (via real-time analysis) and then predicts unexpected wear and damage. This reduces error rates, boosts quality, increases reliability, and optimizes throughput.  
 

 


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Robot Arm Free Play Behaviour

Real-time monitoring of vibrations empowers users to make rapid adjustments or even halt operations if necessary, preventing excursion and minimizing downtime.

Chunk Pin Undercut Behavior

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One point stands for 1 wafer target move vibration behavior

One point stands for 1 wafer target move vibration behavior

One point stands for 1 wafer target move vibration behavior

Multiple points can be selected to compare behavior

Multiple points can be selected to compare behavior

Undesired behavior can be configured through SPC control for real-time alert to users 

Serebro's historical chart provides insights into performance trends, aiding in maintenance decisions. Rapid alerts not only prevent malfunctions from worsening but also minimize downtime.

POLISHING CONDITION MONITORING

Sigenic provides reliable health monitoring solutions for wafer polishing machines. These services provide precision results. The condition monitoring technologies improve process reliability and are designed to ease machine operation. The analysis provides insight of the polishing conditions, reducing chances of excursions from the optimal result. 

 

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ROBOT STA
POLISHING
PREDCTIVE
CONSUMABLE

Maintaining stable conditions of CMP process is vital to chipset production

Padcon harmonic unstable

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* The above images are from just one set of the real-time data captured with our system. Please contact us should you need detailed case studies. CMP stability issues are broad and this was just one scenario. Approach us for a free consultation to identify our solutions applied to your issues. 

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